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ANSYS
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3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and… 3D-IC Foundry Frameworks
SFF & SAFE™ Forum 2023 San Jose, CA
Signia by Hilton 170 S Market Street, San JoseDay 1 June 27th, 2023 12:00 - 1:00pm PDT Networking Lunch & Registration 1:00 - 1:05pm PDT Opening Jinman Han EVP, Head of DSA Office, Samsung Electronics 1:05 - 1:20pm PDT… SFF & SAFE™ Forum 2023 San Jose, CA
Design and Analysis of Multi-Die & 3D-IC Systems
The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from… Design and Analysis of Multi-Die & 3D-IC Systems