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3D-IC Foundry Frameworks
July 20 @ 8:00 am - 9:00 am PDT
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.
About this Webinar
Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs, as evidenced by the technology directions from TSMC, Samsung, and Intel. We’ll present a comprehensive overview of these technologies, and the Ansys flows to address EMIR, Thermal integrity, and mechanical stress challenges posed by these 3DIC systems.
What You Will Learn
- Advanced 3DIC packaging trends and challenges faced by engineers
- 3DIC system data flows from P&R to analysis tools
- EMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM