Design and Analysis of Multi-Die & 3D-IC Systems

The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from TSMC, provide advantages by significantly reducing the interconnect length and signal power loss. These new technologies have introduced the need for innovative ways to solve novel physics challenges. Solving the complex issues related to the structural, thermal, power, and signal integrity of the entire 2.5D/3D-IC system cannot be accomplished using only traditional tools. Advanced simulation methods and highly accurate solvers are required to accurately predict the entire multiphysics coupling in 3D-IC systems including interposers and heterogeneous components.

In this webinar, Jerome discusses the latest developments in 3D-IC design, challenges, and how simulation is the key to successful 3D-IC design. He also presents a comprehensive environment to simulate these physics and achieve the Structural, Thermal, Power, and Signal integrity of the entire 3D-IC system. Chiplet designers, Interposer designers, 3D-IC designers, and 3D-IC architects will find this webinar helpful.

Presenter:

Jerome Toublanc has over 20 years of Semiconductor industry experience, working for various EDA companies such as Avanti, Synopsys, and Apache. He has contributed to the successes of worldwide customers in roles ranging from Application Engineer to Product Management and has covered the chip development flow from RTL to GDSII. He is now a business development executive for Ansys. His mission is to identify emerging Multiphysics Integrity challenges within the semiconductor industry and develop product solutions for the complete Chip-Package-PCB ecosystem.

*This webinar is in partnership with SemiWiki and Ansys*