ASIC
Latest Past Events
ORConf 2024
Gothenburg GothenburgOur 10th ORConf! The FOSSi Foundation is proud to announce the 10th installment of ORConf, a conference dedicated to free and open source silicon to be held over the weekend of Friday September 13 to Sunday September 15 in Gothenburg, Sweden. ORConf is a weekend of presentations and networking for the open source silicon community.… ORConf 2024
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… DFT for chiplets & 3D ICs using Tessent Multi-die
Latest Innovations and Updates in ASICs
In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%. Topics Include: - OpenFrame - a new version of Caravel that gives 50% more area - GPIO configuration questions - The new cocotb testing framework… Latest Innovations and Updates in ASICs