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ASIC
Latest Past Events
ORConf 2024
Gothenburg GothenburgOur 10th ORConf! The FOSSi Foundation is proud to announce the 10th installment of ORConf, a conference dedicated to free and open source silicon to be held over the weekend… ORConf 2024
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after… DFT for chiplets & 3D ICs using Tessent Multi-die
Latest Innovations and Updates in ASICs
In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%.… Latest Innovations and Updates in ASICs