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56th International Microelectronics Assembly and Packaging Society (IMAPS)

This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly.  IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D,… Read More »56th International Microelectronics Assembly and Packaging Society (IMAPS)

Verisium Debug for UVM Testbench

Verisium Debug offers comprehensive debugging capabilities. From RTL and UVM testbench to UPF low-power designs, Cadence’s unified debugging platform helps users debug. In this webinar, users will learn about the available features in Verisium Debug for UVM testbench and use these unique capabilities to visualize and debug the UVM testbench. What you will learn Understand… Read More »Verisium Debug for UVM Testbench

EDPS 2023

Synopsys Building 1 800 North Mary Avenue, Sunnyvale, CA, United States

EDPS 2023 is approaching fast! The program is firming up - please see the program page for a preliminary list of talks. REGISTRATION IS NOW OPEN. Everyone, including speakers, must register. Note that this year we'll be meeting on the Synopsys Campus. Synopsys Building 1 800 North Mary Avenue Sunnyvale, CA, 94085   Most of the talks… Read More »EDPS 2023

International Test Conference 2023

Disneyland Hotel 1150 West Magic Way, Anaheim, CA, United States

International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how… Read More »International Test Conference 2023

Proactively Address Thermal Concerns in Advanced IC Packages

The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation. This webinar will show how design… Read More »Proactively Address Thermal Concerns in Advanced IC Packages

IEEE 32nd Asian Test Symposium

With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems, incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. The Asian Test Symposium (ATS)… Read More »IEEE 32nd Asian Test Symposium

Jasper User Group 2023

Ready to share and discuss the latest design and verification best practices with your peers from around the world? It’s time for our annual CadenceCONNECT: Jasper™ User Group Conference, held on October 18 and 19 at the Cadence San Jose campus. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around… Read More »Jasper User Group 2023

Soar to New Heights of Productivity using Cadence Managed Cloud Services

Date: Wednesday, October 18, 2023 Time: 8:30am PT | 10:30am CT | 11:30am ET Join us for this 45-minute webinar to learn how the Cadence-managed, EDA-optimized, ready-to-use, and secure ISO-certified cloud platform delivers a fully integrated and proven environment to jump-start product design, verification, and implementation. See the platform in action as we demo the productivity features… Read More »Soar to New Heights of Productivity using Cadence Managed Cloud Services

The Race is On!

Brazos Hall East 4th Street, Austin, TX, United States

Event Overview Date: Wednesday, October 18, 2023 Time: 8:30am – 4:00pm, followed by an exclusive networking event Location: Brazos Hall, Austin, TX There is an unprecedented demand for advanced-node chip design that pushes beyond traditional boundaries. Computing power, security, reliability, and other multifaceted requirements have surpassed the basic performance, power consumption, and area constraints of traditional chip design. The… Read More »The Race is On!

DVCon Europe 2023

Holiday Inn Munich - City Centre Hochstraße 3, Munich, Germany

The Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system, software, design, verification, validation and integration. It is a place where the latest methodologies and technologies of tools, languages, and standards for integrated and embedded systems and products are shared and discussed. Applications of interest include (but… Read More »DVCon Europe 2023

IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS)

Hilton Maslak Büyükdere Cd. No:233, Istanbul, Turkey

The IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS) will be held in Istanbul, Turkey 4-7 December 2023. As the flagship conference of IEEE Circuits and Systems Society in Region 8 (Europe, Middle East, and Africa), ICECS 2023 will consist of tutorials, plenary lectures, regular, special and poster sessions focusing on recent trends,… Read More »IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS)

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