Celsius
Latest Past Events
Design, Integrate, Analyze and Manage with Allegro X
Designing PCBs in today’s world means using multiple tools to get the job done. The Allegro X Design Platform allows you to access all these tools in one unified design environment. Join us to discuss how you can reduce your cycle time, ensure product reliability and get first-time-right designs with Allegro X. Topics we’ll cover… Design, Integrate, Analyze and Manage with Allegro X
Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments in the newly-introduced Cadence Celsius Studio AI-enabled multiphysics thermal platform to solve today’s thermal stress and warpage analysis in 3D-ICs.… Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This solution must also offer the ability to simulate the entire design efficiently, providing confidence in system signoff. Join our webinar… Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform