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Latest Past Events

Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs

Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments in the newly-introduced Cadence Celsius Studio AI-enabled multiphysics thermal platform to solve today’s thermal stress and warpage analysis in 3D-ICs.… Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs

Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform

With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This solution must also offer the ability to simulate the entire design efficiently, providing confidence in system signoff. Join our webinar… Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform