Celsius
Thermal Analysis for MMIC and RF PCB Power Applications
Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs. Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. This webinar will highlight how the Celsius Thermal Solver uses design… Thermal Analysis for MMIC and RF PCB Power Applications
Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
The Cadence® AWR® V16 for RF Design Excellence Webinar Series introduces the latest capabilities in Cadence® AWR Design Environment® Version 16 (V16), providing ready access to Cadence Clarity™ 3D Solver and Celsius™ Thermal Solver for unconstrained capacity to solve large-scale and complex RF systems directly from within the RF design platform. Our next webinar in… Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
SEMI-THERM
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesSEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from integrated circuits to facilities, fosters discussions between thermal engineers, professionals, and industry experts, and encourages the exchange of information on academic and industrial advances in electronics cooling. Symposium Highlights Technical… SEMI-THERM
Proactively Address Thermal Concerns in Advanced IC Packages
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation. This webinar will show how design… Proactively Address Thermal Concerns in Advanced IC Packages
System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… System-Level Thermal Signoff from Chips Through to Racks
Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This solution must also offer the ability to simulate the entire design efficiently, providing confidence in system signoff. Join our webinar… Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments in the newly-introduced Cadence Celsius Studio AI-enabled multiphysics thermal platform to solve today’s thermal stress and warpage analysis in 3D-ICs.… Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Design, Integrate, Analyze and Manage with Allegro X
Designing PCBs in today’s world means using multiple tools to get the job done. The Allegro X Design Platform allows you to access all these tools in one unified design environment. Join us to discuss how you can reduce your cycle time, ensure product reliability and get first-time-right designs with Allegro X. Topics we’ll cover… Design, Integrate, Analyze and Manage with Allegro X