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Celsius
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Design, Integrate, Analyze and Manage with Allegro X
Designing PCBs in today’s world means using multiple tools to get the job done. The Allegro X Design Platform allows you to access all these tools in one unified design…
Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a…
Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before…