Chiplet

Events Search and Views Navigation

Event Views Navigation

Today

  • Cadence, Multi-Chiplet

    CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform

    Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which must be considered early during planning and implementation. The new Cadence® Integrity™ 3D-IC platform provides innovative technology that proactively looks ahead through integrated planning, implementation,… CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform

  • SEMICON Japan 2022

    SEMICON Japan + Advanced Packaging and Chiplet Summit

    Tokyo Big Sight 3 Choe-11-1 Ariake, Tokyo, Japan

    SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently,… SEMICON Japan + Advanced Packaging and Chiplet Summit

  • Chiplet Summit

    Chiplet Summit

    DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United States

    The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Chiplet Summit