Chiplet
CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which must be considered early during planning and implementation. The new Cadence® Integrity™ 3D-IC platform provides innovative technology that proactively looks ahead through integrated planning, implementation,… Read More »CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
SEMICON Japan + Advanced Packaging and Chiplet Summit
Tokyo Big Sight 3 Choe-11-1 Ariake, Tokyo, JapanSEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently,… Read More »SEMICON Japan + Advanced Packaging and Chiplet Summit
Chiplet Summit
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesThe First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Read More »Chiplet Summit
IP Lifecycle Management for Chiplet-Based SoCs
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges however, especially in the context of IP… Read More »IP Lifecycle Management for Chiplet-Based SoCs
Accelerating Mainstream Adoption of Multi-Die Systems
Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast of the panel where each company shares their view on the groundbreaking technology, what challenges lie ahead, and how companies can realize the promise of… Read More »Accelerating Mainstream Adoption of Multi-Die Systems
UCIe-Based Chiplet Verification – from IP to SoC
Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express (UCIe) enables end users to combine chiplets with different functionality and technology nodes to develop highly sophisticated electronic chips. Hence,… Read More »UCIe-Based Chiplet Verification – from IP to SoC
Why Chiplets with UCIe are the Next Big Thing
Artificial intelligence (AI) and virtual reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular dies that use UCIe, an open industry standard, to communicate with each other. Combined in a Systems-on-Package (SoP), they provide superior performance, reduced power consumption, and increased design flexibility for customized applications… Read More »Why Chiplets with UCIe are the Next Big Thing
Chiplet Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Read More »Chiplet Summit
Exploring the Advancement of Chiplet Technology and the Ecosystem
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industry by the end of this decade. Even with this massive growth, manufacturers recognize the… Read More »Exploring the Advancement of Chiplet Technology and the Ecosystem
Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP
Multi-die SoC containing multiple RISC-V clusters, GPU, NPU, accelerators and DNN have considerable benefits for applications in automotive, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models, and multiple coherent and non-coherent compute resources. This Webinar will demonstrate a methodology for rapid modeling and architecture trade-off using UCIe in modeling… Read More »Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP