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Chiplets: Building the Future of SoCs
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing in various industries, particularly fueled by the widespread adoption of AI technology. However, while the concept of using chiplets to construct larger chips to overcome… Chiplets: Building the Future of SoCs
EE Times – AI Everywhere Forum
Artificial intelligence (AI) is pervading almost every area of electronics today: from data centers, through edge accelerators to endpoint devices. Applications range from large scale analysis of medical data and online retail recommendation engines, to robotics and computer vision, to sensor fusion in the tiniest sensor nodes. The infusion of AI techniques into so many… EE Times – AI Everywhere Forum
EE Times: Advanced Automotive Tech Forum
In the last year, the evolution towards electric vehicles accelerated faster than anticipated. Autonomous driving technology has already been pushed from a short-term priority to a long-term goal, but the race to be first with AVs remains fierce. Meanwhile, there seems to be a shift in priorities from driver-assist technologies toward driver monitoring systems. The… EE Times: Advanced Automotive Tech Forum