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DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after… DFT for chiplets & 3D ICs using Tessent Multi-die
Implementing DFT in 2.5/3D designs using Tessent Multi-die software
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor… Implementing DFT in 2.5/3D designs using Tessent Multi-die software