OIP
Latest Past Events
2024 TSMC Europe OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, AmsterdamLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… 2024 TSMC Europe OIP Ecosystem Forum
TSMC 2023 Open Innovation Platform Ecosystem Forum – China
Shangri-La Nanjing Hotel 29 Zhongyang Road, Gulou District, NanjingJoin us at the TSMC 2023 China OIP Ecosystem Forum! China OIP Ecosystem Forum (In-Person Event) Date: November 15, 2023 (Wednesday) Time: 9:30a.m. - 5:45p.m. Venue: Shangri-La Nanjing Hotel 329 Zhongyang Road, Gulou District, Nanjing, Jiangsu Province, 210037 China China OIP Ecosystem Forum (Online VOD Event) Date: November 22, 2023 (Wednesday) Website link to be provided in November.… TSMC 2023 Open Innovation Platform Ecosystem Forum – China
TSMC 2022 OIP – California
Santa Clara Convention Center 5001 Great America Parkway, Santa ClaraJoin the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! Register Now Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging… TSMC 2022 OIP – California