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TSMC 2022 OIP – California
October 26, 2022 @ 9:00 am - 6:30 pm PDT
Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!
Learn About:
- Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
- Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
- Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
- Ecosystem-specific TSMC reference flow implementations, P& R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
- Successful, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers
For more information on the TSMC OIP Ecosystem Forum, e-mail us at: tsmcevents@tsmc.com.
We look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum!
Your health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention, California Department of Public Health, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal, state and local laws, then adapt TSMC plans accordingly and share updates with you.