packaging
Latest Past Events
EDAPS 2024
Taj Yeshawantpur 2275 Tumkur Road, Yeshwantpur, BangaloreThe IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all… EDAPS 2024
Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
About this webinar Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling. In addition, manufacturing the packaging containers as optimally as possible to avoid defects is vitally important. All in the landscape… Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
User2User Europe 2024
Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, MunichUser2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and… User2User Europe 2024