packaging
IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on… Read More »IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
19th Annual Device Packaging Conference (DPC 2023)
WeKoPa Conference Center 10438 WeKoPa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… Read More »19th Annual Device Packaging Conference (DPC 2023)
56th International Microelectronics Assembly and Packaging Society (IMAPS)
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D,… Read More »56th International Microelectronics Assembly and Packaging Society (IMAPS)