packaging
IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on… IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
19th Annual Device Packaging Conference (DPC 2023)
WeKoPa Conference Center 10438 WeKoPa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th Annual Device Packaging Conference (DPC 2023)
56th International Microelectronics Assembly and Packaging Society (IMAPS)
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D,… 56th International Microelectronics Assembly and Packaging Society (IMAPS)
User2User Europe 2024
Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Munich, GermanyUser2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and… User2User Europe 2024
Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
About this webinar Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling. In addition, manufacturing the packaging containers as optimally as possible to avoid defects is vitally important. All in the landscape… Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
EDAPS 2024
Taj Yeshawantpur 2275 Tumkur Road, Yeshwantpur, Bangalore, IndiaThe IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all… EDAPS 2024