Power Integrity
Latest Past Events
Addressing 3D-IC Power Integrity Design Challenges
Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs). In this webinar, you will learn how the Cadence… Addressing 3D-IC Power Integrity Design Challenges
AI-Powered Electromagnetics Symposium
Cadence Design Systems, Building 5 2655 Seely Avenue, San JoseAccelerate Your Designs with Generative AI-Powered Multiphysics Analysis and Optimization How are you addressing the ever-increasing complexity and density of your high-performance electronic systems? What role do electromagnetic effects such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), power integrity, and signal integrity play? Discover how Cadence is transforming electromagnetic (EM) simulation for optimal design performance with… AI-Powered Electromagnetics Symposium
IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis
Cadence Design Systems, Building 5 2655 Seely Avenue, San JosePower integrity (PI) is a major challenge for chip designers in the era of ubiquitous data, hyperconnectivity, and AI. Design size is exploding, and innovations in heterogenous integration are adding to PI complexity. These changes and challenges are ushering in the IR2.0 era ― a new paradigm for power integrity design and analysis. As a… IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis