SI
Common Challenges when Designing IoT PCBs – And How to Solve Them with Cadence
While IoT devices may seem simple to the end users (which is good), the electrical design complexity of these devices is often very high. Designers are required to work with limited board space while functionality and speed requirements continue to increase. These tight spaces, combined with the required highspeed signaling, leads to increased susceptibility to… Read More »Common Challenges when Designing IoT PCBs – And How to Solve Them with Cadence
ISTFA 2023
Phoenix Convention Center 100 North Third Street, Phoenix, AZ, United StatesSaving global resources by increasing energy efficiency is among the most significant problems that global society must address today. To achieve this, a major target is developing efficient and reliable power electronics devices for providing the required high-performing hardware components. Power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) technologies are becoming increasingly… Read More »ISTFA 2023