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SemIsrael Tech Webinar
13:30 - 14:00 Low Power Design An Effective Path to Low-Power Design The demand for green and energy efficient products is increasing but getting there has never been easy. In…
Implementing DFT in 2.5/3D designs using Tessent Multi-die software
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor…
DVClub Europe – Best Conference Papers from 2022
Best Conference Papers from 2022 These papers are selected from DVCon and CadenceLive! in 2022 as being most relevant to the DVClub Europe community. Agenda (GMT) 12:00 Welcome and Introduction…