Siemens
Effectively Addressing the Challenge of Securing Connected and Autonomous Vehicles
Overview As vehicles get more complex and connected, the attack surface increases. This presents increasing challenges for cybersecurity. This webinar introduces hardware based techniques for addressing security concerns, from legacy through to the future. What will you learn? The best use of threat modelling techniques Methods for staying one step ahead of malicious hackers in… Effectively Addressing the Challenge of Securing Connected and Autonomous Vehicles
Iternational Test Conferece
International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how… Iternational Test Conferece
CXL and IDE: Important Considerations of Protecting High Speed Interconnects
In a few short years, CXL (Compute Express Link) has evolved from an idea to a rapidly proliferating low latency interconnect standard being adopted into data centers, high performance computing, and cloud computing. However, as the adoption has increased, so has the security threat model users face. To address this, the CXL 2.0 standard has… CXL and IDE: Important Considerations of Protecting High Speed Interconnects
FPGA Conference and Hackathon
We are changing the world through this. So you can! Join the FPGA Hackathon we organize in Kraków to learn more about the technology gaining more and more popularity! Sharing this passion is the reason why we decided to create this Conference and Hackathon. FPGA technology is one of the foundations for the revolutionary projects… FPGA Conference and Hackathon
IMAPS Device Packaging
We-Ko-Pa Resort & Conference Center 10438 Wekopa Way, Fort McDowell, AZ, United StatesThe 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in… IMAPS Device Packaging