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SPICE

Optimal circuit sizing strategies for performance, low power, and high yield of analog and full custom IP

There have always been good reasons to port designs to new foundries or processes. These reasons have included reusing IP in new projects, moving an entire design to a smaller node to improve PPA, or second sourcing manufacturing. While there can be many potential business motivations for any of the above, in today’s environment with… Read More »Optimal circuit sizing strategies for performance, low power, and high yield of analog and full custom IP

How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV

In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will also present the latest product enhancements and introduce the new Utmost IV Corner and Retargeting Module. To conclude, we will… Read More »How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV

How to Eliminate Image Retention Issues with SmartSpice Flex Modeling

Image retention is a long-standing issue in the display community. To effectively solve this issue, or even to minimize its impact on their products, display manufacturers and consumer electronics vendors need to simulate this effect at the SPICE level. However, image retention is a result of dynamic device effects that cannot be modeled by other… Read More »How to Eliminate Image Retention Issues with SmartSpice Flex Modeling

Power Devices SPICE Modeling for Si, GaN and SiC Technologies

We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Read More »Power Devices SPICE Modeling for Si, GaN and SiC Technologies

SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies

The demand for Custom ICs is on the rise globally along with high proliferation of semiconductor content. Higher requirements on power, performance, area, and yield, as well as other factors such as advanced process nodes and mission-critical applications have increased the need for accurate verification across process, voltage, and temperature corners, as well as local… Read More »SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies