SPICE
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Optimal circuit sizing strategies for performance, low power, and high yield of analog and full custom IP
There have always been good reasons to port designs to new foundries or processes. These reasons have included reusing IP in new projects, moving an entire design to a smaller node to improve PPA, or second sourcing manufacturing. While there can be many potential business motivations for any of the above, in today’s environment with… Optimal circuit sizing strategies for performance, low power, and high yield of analog and full custom IP
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How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV
In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will also present the latest product enhancements and introduce the new Utmost IV Corner and Retargeting Module. To conclude, we will… How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV
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How to Eliminate Image Retention Issues with SmartSpice Flex Modeling
Image retention is a long-standing issue in the display community. To effectively solve this issue, or even to minimize its impact on their products, display manufacturers and consumer electronics vendors need to simulate this effect at the SPICE level. However, image retention is a result of dynamic device effects that cannot be modeled by other… How to Eliminate Image Retention Issues with SmartSpice Flex Modeling
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Power Devices SPICE Modeling for Si, GaN and SiC Technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Power Devices SPICE Modeling for Si, GaN and SiC Technologies
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SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
The demand for Custom ICs is on the rise globally along with high proliferation of semiconductor content. Higher requirements on power, performance, area, and yield, as well as other factors such as advanced process nodes and mission-critical applications have increased the need for accurate verification across process, voltage, and temperature corners, as well as local… SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
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Deploying Solido Design Environment AI Workflows on AWS
Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on… Deploying Solido Design Environment AI Workflows on AWS
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Mastering EMC Simulations for Electronic Designs
Overview Electromagnetic Compatibility (EMC) simulation is critical for ensuring that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases, the importance of EMC simulation grows, allowing engineers to predict and mitigate potential electromagnetic interference (EMI) issues before physical prototypes are built. For EMC and… Mastering EMC Simulations for Electronic Designs
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Siemens EDA Custom IC Verification Forum – Austin, TX
Topgolf Austin 2700 Esperanza Crossing, Austin, TX, United StatesJoin us and learn how Siemens’ intelligent Custom IC Verification platform is transforming the custom IC verification landscape with AI-powered methods and the latest in circuit simulation technology! Our expert speakers will provide insight on IC verification topics such as circuit simulation, mixed signal verification, nominal to high-sigma variation analysis, library characterization, and IP QA.… Siemens EDA Custom IC Verification Forum – Austin, TX
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Interactive SPICE Model Verification Platform ME-Pro
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features… Interactive SPICE Model Verification Platform ME-Pro