Tessent
Implementing DFT in 2.5/3D designs using Tessent Multi-die software
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor ecosystem in bringing 2.5D and 3D ICs designs to the mainstream, including design-for-test (DFT). If you are an engineer, DFT manager, CAD director or someone… Read More »Implementing DFT in 2.5/3D designs using Tessent Multi-die software
Siemens Tessent DFT Forum 2023 India
Hotel Radisson Blu Marathalli ORR, Bengaluru, IndiaAbout Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent Design-for-Test (DFT) India Tech Forum, being held in Hotel Radisson Blu, Marathalli ORR, Bengalur India, on 29th March, 2023 learn from Industry leaders, fellow designers and experts from Siemens about how to leverage the Tessent… Read More »Siemens Tessent DFT Forum 2023 India