Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which must be considered early during planning and implementation. The new Cadence® Integrity™ 3D-IC platform provides innovative technology that proactively looks ahead through integrated planning, implementation,… Read More »CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform