Skip to content

2.5D Packaging

Ansys, January 24, 2023

Signal Integrity Issues for Silicon Interposers

The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging… Read More »Signal Integrity Issues for Silicon Interposers

Siemens EDA

Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability… Read More »Protocol and Memory Interface Verification in the Shrinking World of 3DIC