Skip to content

3D Packaging

Ansys, Feb 7, 2024

Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier,… Read More »Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

Siemens EDA

Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability… Read More »Protocol and Memory Interface Verification in the Shrinking World of 3DIC