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ANSYS

Ansys, June 13, 2023

Run Ansys HFSS in the Cloud with AWS to Boost Simulation

About This Webinar Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and… Read More »Run Ansys HFSS in the Cloud with AWS to Boost Simulation

Ansys, March 23, 2023

Thermal Integrity Challenges and Solutions of Silicon Interposer Design

In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation… Read More »Thermal Integrity Challenges and Solutions of Silicon Interposer Design

Ansys, January 24, 2023

Signal Integrity Issues for Silicon Interposers

The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging… Read More »Signal Integrity Issues for Silicon Interposers