Accelerating Mainstream Adoption of Multi-Die Systems

Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast of the panel where each company shares their view on the groundbreaking technology, what challenges lie ahead, and how companies can realize the promise of multi-die systems. Whether you are exploring multi-die systems or implementing the architecture in your current designs, you’ll need the entire ecosystem across the semiconductor supply chain to help you make the adoption easier. Don’t miss the discussion.

Moderator: Marco Chiappetta
HotTech Vision & Analysis​
Principal Analyst​

Panelist: Murat Becer
Ansys
Vice President, Semiconductor R&D​

Panelist: Michael Schaffert
Bosch
Senior Vice President E/E-Architecture​

Panelist: Lalitha Immaneni
Intel
Vice President, Architecture, Design, and Technology Solutions, Technology Development

Panelist: Cheolmin Park
Samsung
Corporate VP of AVP Business Development Team​

Panelist: Shekhar Kapoor
Synopsys
Senior Director of Product Line Management