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TSMC, November 19, 2024

2024 TSMC Europe OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 

WTS, November 12-14, 2024

IEEE World Technology Summit – AI INFRASTRUCTURE

This event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems, focusing on these core areas: AI applications and their required infrastructure Silicon… 

Cadence, November 14, 2024

AI-Driven Constraint Generation for PCB and IC Package Design

Join our webinar to discover how AI-driven optimization and automation in constraint generation can boost productivity and shorten design cycles for PCB and IC package design. Learn how integrating Allegro X and Sigrity X can… 

DVClub Europe

DVClub Europe – AI/ML in Verification

This DVClub will consider how we can save time and effort whilst improving time-to-market through the application of AI/ML to design verification. Agenda (GMT): Time Session Description Slides Videos 12.00 GMT Welcome and Introduction –… 

2024 OCP Global Summit

2024 OCP Global Summit

The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships… 

CES 2025

CES 2025

The world’s most powerful tech event is your place to experience the innovations transforming how we live. This is where global brands get business done, meet new partners and where the industry’s sharpest minds take…