Antenna/RF design problems often involve the optimization of many variables, requiring numerous evaluations (EM simulations) using traditional optimization methods. Design engineers need an intelligent, accurate,… Read More »AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
ChipEx2024, the largest annual event of the Israeli semiconductor industry, will be held on May 7-8, 2024 in Tel Aviv, Israel. ChipEx2024 showcases companies including… Read More »ChipEx 2024
The CXL Consortium is looking forward to hosting the first Compute Express Link® (CXL®) DevCon from April 30 – May 1, 2024, in Santa Clara,… Read More »CXL DevCon 2024
A worldwide connected Event !! D&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and… Read More »IP-SoC Silicon Valley 2024
13 days to go the next DVClub Europe meeting takes place on Tuesday 23rd April with a theme of “Formal Verification“. Formal Verification can help you find bugs earlier… Read More »DVClub Europe – Formal Verification
The premier event for the design and design automation of electronic chips to systems. Autonomous Systems Electronics content in modern autonomous systems (e.g., automotive, robotics, drones, etc.)… Read More »DAC 2024
The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile… Read More »Embedded Vision Summit 2024
Identifying sources of electromagnetic (EM) coupling and safeguarding today’s complex electronic designs from EM crosstalk are daunting tasks. For designs with multiple levels of hierarchy,… Read More »Hierarchical Analysis of EM Crosstalk with EMX Planar 3D Solver
Join us for an informative webinar, as we unveil the capabilities of our cloud solutions designed to revolutionize EDA workloads. Whether you require completely hosted… Read More »Cadence Managed Cloud for Cost Efficient and Productive Chip Design
With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect… Read More »Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform