Formal Verification for Non-Specialists
Is formal verification ready for general use or do you need a PhD to use it? Larger companies continue to recruit formal PhDs into their verification… Read More »Formal Verification for Non-Specialists
Cadence
Embedded World
The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry… Read More »Embedded World
DVClub Europe – Best Conference Papers from 2022
Best Conference Papers from 2022 These papers are selected from DVCon and CadenceLive! in 2022 as being most relevant to the DVClub Europe community. Agenda… Read More »DVClub Europe – Best Conference Papers from 2022
ISCAS 2023
The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere… Read More »ISCAS 2023
MWC 2023
Where technology, community and commerce converge MWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator,… Read More »MWC 2023
Low-Power Verification Using Xcelium Simulation
Don’t let power-related issues that appear late in the verification cycle impact your project schedule. Register for a webinar that shows you how to catch… Read More »Low-Power Verification Using Xcelium Simulation
ASP-DAC 2023
ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at… Read More »ASP-DAC 2023
DesignCon 2023
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.… Read More »DesignCon 2023
Merry Christmas 2022
I found the first holiday video from Ansys posted on December 14th, so enjoy the photos and videos to bring you some cheer as 2022… Read More »Merry Christmas 2022
IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for… Read More »IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)