Skip to content
Synopsys, November 9, 2023

Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems

Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges. … Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems

ERI 2.0

ERI 2.0 Summit

Watch as leaders from our government agencies, the Defense Industrial Base, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry, national and economic security, and future research directions. The Electronics Resurgence… ERI 2.0 Summit

DARPA ERI

ERI Summit & MTO Symposium

What is the ERI Summit & MTO Symposium? The DARPA Microsystems Technology Office (MTO) Electronics Resurgence Initiative (ERI) is a response to several technical and economic trends in the microelectronics sector. Among these trends, the… ERI Summit & MTO Symposium