Skip to content

MMIC

Cadence, October 18, 2022

Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated… Read More »Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

Cadence, August 30, 2022

Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated… Read More »Integrated Thermal Analysis for RF MMIC and PCB Power Applications

%d bloggers like this: