Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information.

Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. With the recent integration of the Celsius Thermal Solver within the Cadence AWR Design Environment platform, RF designers now have access to electrothermal analysis for monolithic microwave IC (MMIC)/RFIC, PCB, and module designs.

Speakers

David Vye is the product manager for the AWR products at Cadence, where he helps drive product direction and customer engagements as they relate to RF and microwave components and system design. Mr. Vye has held product and technical marketing positions at Cadence AWR, Ansys, and Ansoft. He was the editor and biz dev manager at Microwave Journal from 2007 to 2014. Before moving to technical marketing. He was a Sr. MMIC designer and research scientist at Raytheon and MACOM.

Dustin Hoekstra is an applications engineer architect supporting the AWR products at Cadence.  He has been in the RF and microwave industry for more than 20 years, holding previous applications and design positions at GaAs and GaN semiconductor manufacturing companies Cree, Excelics, and Filtronic. Having been part of the AWR team since 2005, he currently supports many of Cadence’s top strategic customers. Mr. Hoekstra earned a bachelor’s degree in electrical engineering and computer sciences from the University of California at Berkeley.