IMS will be presented in-person, 11-16 June 2023 in San Diego, CA. IMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency… International Microwave Symposium – IMS 2023
Synopsys Webinar | Thursday, May 25, 2023 | 9:00 a.m. PT According to a recent Semico Research report, the RISC-V Core IP market is expected to grow at a 34.9% CAGR through year 2027. With… Don’t Take the Risk, Formally Verify Your RISC-V Cores
Synopsys Webinar | Wednesday, May 24, 2023 | 10:00 – 10:45 a.m. IST Engineering resources are getting stretched thinner and thinner as design complexity increases. Automation is a significant driver to help engineers overcome resource… Accelerate Coverage Closure and Debug with Synopsys AI-Driven Verification Solutions
Wednesday, May 24, 2023 and Thursday, May 25, 2023 The industry is moving to multi-die systems to benefit from the greater compute performance, increased functionality, and new levels of flexibility. Challenges for multi-die systems are… Requirements for Multi-Die System Success
Wireless devices are ubiquitous, all requiring RF ICs to transmit and receive radio waves via antennas. The radio range can be a few meters for applications such as Bluetooth and WiFi to many kilometers for… Synopsys RF / mmWave IC Design Reference Flow with TSMC N6RF and N16FFC Process Nodes
Theme Artificial Intelligence, Machine Learning, and Deep Learning: Tactical and Strategic Impacts to Microelectronics Design and Test About MDTS 2023 The IEEE Microelectronics Design & Test Symposium (MDTS) provides a forum for academic and industry… The 32nd Microelectronics Design and Test Symposium (MDTS 2023)
With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems, incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet… IEEE 32nd Asian Test Symposium
The combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. For Enterprise ML Experts: Attend a unique AI systems event that will… AI Hardware & Edge AI Summit
The need for faster and more efficient Ethernet solutions has never been greater, as the demands of high-performance computing and the rise of big data continue to grow. Join us as we explore the main… The Path to 1.6TbE with 224G Ethernet PHY IP
This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed for complex multi-die system-on-chip (SoC),… Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect