Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC… Read More »Smart methods for DFT chip architecture & validation
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
About Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent… Read More »Siemens Tessent DFT Forum 2023 India
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has… Read More »Implementing DFT in 2.5/3D designs using Tessent Multi-die software