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3DIC 2021

November 15 @ 8:00 am - November 18 @ 5:00 pm PST

3DIC 2021

IEEE International 3D System Integration Conference (3DIC)
November 15-18, 2021
Raleigh, North Carolina, USA

After a one-year hiatus, 3DIC will once again unite 2.5D/3D researchers and developers from all around the world.  This year’s conference employs a hybrid format of in-person events and virtual events.  Talks, panels, exhibits, papers, and discussions will foster a stimulating exchange of ideas and technical information.

So much has changed since the first 3DIC conference in 2010!  3D integrated circuits have moved from academic curiosity to solid commercial reality.  The underlying technologies continually improve and evolve, incorporating new methods and resources.  Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates.  This conference will focus on the research and science of 3DICs.  It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

Registration is now open!

The schedule is available for download.

Prospective attendees may also subscribe to receive email updates.

Details

Start:
November 15 @ 8:00 am PST
End:
November 18 @ 5:00 pm PST
Event Category:
Event Tags:
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Event Website

Organizer

IEEE
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Venue

North Carolina State University
1101 Garman St.
Raleight, NC 27606 United States
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