The UCIe™ 1.1 Specification: Future Applications of Chiplets
October 12 @ 10:00 am - 11:00 am PDT
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel
The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. This webinar will provide an overview on enhancements made in the UCIe 1.1 specification and architectural specification attributes to define system setups and registers that will be used in test plans and compliance testing to ensure device interoperability. The presentation will also explore additional enhancements included for automotive usages – such as predictive failure analysis and health monitoring – and enabling lower-cost packaging implementations. Attendees will have a chance to participate in a live Q&A discussion immediately after the webinar to address questions from the presentation.