IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in… Read More »IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
RISC-V Summit
San Jose Convention Center 150 W San Carlos Street, San JoseEach day, thousands of engineers around the world collaborate and contribute to advance the most prolific open, license and royalty-free computing architecture. They share technical investment and help shape the architecture’s… Read More »RISC-V Summit
EE Times – AI Everywhere Forum
Artificial intelligence (AI) is pervading almost every area of electronics today: from data centers, through edge accelerators to endpoint devices. Applications range from large scale analysis of medical data and… Read More »EE Times – AI Everywhere Forum