EDA
DesignCon 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart… Read More »DesignCon 2024
Canada’s Semiconductor Summit
Brookstreet Hotel 525 Leggett Drive, Ottawa, CanadaHelp build Canada's role in North America's integrated semiconductor supply chain. Featuring key industry and government decision-makers from Canada, the United States, and international jurisdictions, your insights at this by-invitation-only… Read More »Canada’s Semiconductor Summit
Functional Verification workflow for Trusted and Assured Microelectronics
In a world of increasing trust and assurance challenges for microelectronic devices, emerging industry standards and defense policy demand early and advanced functional verification methods before ICs may be deployed in… Read More »Functional Verification workflow for Trusted and Assured Microelectronics
Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model… Read More »Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Power Devices SPICE Modeling for Si, GaN and SiC Technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various… Read More »Power Devices SPICE Modeling for Si, GaN and SiC Technologies
Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment uncovers SI/PI issues early… Read More »Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Power Innovations in Consumer Electronics Using LF EM Solutions
This webinar will cover how the Ansys simulation tools are now widely used in many low-frequency (LF) EM applications, such as wireless charging, power supplies, transformers, magnetic latches and actuators,… Read More »Power Innovations in Consumer Electronics Using LF EM Solutions
Introducing Ansys AI: A New Chapter in Engineering Simulation
Join us to learn more about the AI and Simulation Revolution in this upcoming webinar. We're revolutionizing engineering simulation with the power of Artificial Intelligence with SimAI, AnsysGPT, and Ansys… Read More »Introducing Ansys AI: A New Chapter in Engineering Simulation
FPGA Forum 2024 – Norway
Royal Garden Trondheim, NorwayFPGA-forum is a yearly event for the Norwegian FPGA community. FPGA-designers, project managers, technical managers, researchers, final year students and the major vendors gather for a two-day focus on FPGA.… Read More »FPGA Forum 2024 – Norway
Essential Steps to Simplify VHDL Testbenches Using OSVVM
This “Getting Started” webinar focuses on the first, essential steps you need to take when looking to improve your VHDL testbench approach. In this webinar we examine transaction-based testing, self-checking… Read More »Essential Steps to Simplify VHDL Testbenches Using OSVVM
ISSCC 2024
San Francisco Marriot Marquis 780 Mission Street, San Francisco, CA, United StatesThe International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the… Read More »ISSCC 2024
SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
The demand for Custom ICs is on the rise globally along with high proliferation of semiconductor content. Higher requirements on power, performance, area, and yield, as well as other factors… Read More »SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies