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Latest Past Events

CadenceLIVE Europe 2022

Hilton Munich Park Am Tucherpark 7, Munich

CadenceLIVE Europe 2022 will be held on November 21-22 at the Hilton Munich Park hotel. It will feature peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s… CadenceLIVE Europe 2022

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

ASIP University Day 2022

Application-specific instruction set processors (ASIPs) have established themselves as an important implementation option for modern SoCs, i.e. when standard processor IP cannot meet challenging application-specific requirements, and fixed hardware is… ASIP University Day 2022