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Latest Past Events
CadenceLIVE Europe 2022
Hilton Munich Park Am Tucherpark 7, MunichCadenceLIVE Europe 2022 will be held on November 21-22 at the Hilton Munich Park hotel. It will feature peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s…
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join…
ASIP University Day 2022
Application-specific instruction set processors (ASIPs) have established themselves as an important implementation option for modern SoCs, i.e. when standard processor IP cannot meet challenging application-specific requirements, and fixed hardware is…