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  • CES 2023

    Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United States

    CES® is the most influential tech event in the world — the proving ground for breakthrough technologies and global innovators. This is where the world's biggest brands do business and meet new partners, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®, CES features every aspect of the… CES 2023

  • VLSID 2023

    Hyderabad International Convention Cente Hyderabad, Telangana, India

    International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems, is attended by over 2000 engineers, students & faculty, industry, academia, researchers, bureaucrats and government bodies. Semiconductors are the intangible… VLSID 2023

  • Photonics: Riding the Waves Along the Spectrum

    Cadence Design Systems, Bldg 10 2655 Seeley Avenue, San Jose, CA, United States

    Join Cadence in person for the seventh-annual CadenceCONNECT Photonics event and workshop on January 11 and 12 to discuss the successes and impacts of relying mostly on the silicon-based ecosystem in growing the photonics industry. What about applications needing a broader set of wavelengths? Can we expand beyond the traditional domain of silicon photonics? This… Photonics: Riding the Waves Along the Spectrum

  • QuantumATK U-2022.12 Release: Highlights of New and Enhanced Features

    Join our FREE online event to learn about the latest features and performance enhancements in the QuantumATK U-2022.12 product release. See how QuantumATK can provide impactful ROI on : • Quality of Results: Combination of PAW + LCAO where the highest DFT precision is required • Turnaround Time: Using machine-learning, HKMG and MTJ structures can… QuantumATK U-2022.12 Release: Highlights of New and Enhanced Features

  • HiPEAC

    Pierre Baudis Convention Centre 11 esplanade Compans Caffarelli, Toulouse, France

    The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies, cybersecurity, energy efficiency and machine learning. The HiPEAC 2023 conference will take place in Toulouse, France. Associated workshops, tutorials, special sessions, several… HiPEAC

  • ASP-DAC 2023

    Tokyo Odaiba Miraikan 2 Chome-3-6 Aomi, Tokyo, Koto CIty, Japan

    ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2023 is 28th conference. ASP-DAC 2023 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design… ASP-DAC 2023

  • Democratizing IC Design: The IEEE SSCS PICO Program

    Inspired by the possibilities of open-source chip design, the IEEE Solid-State Circuits Society (SSCS) launched its new Platform for IC Design Outreach (PICO) in the summer of 2021. With this program, the SSCS intends to contribute to the new open source movement, forge connections with the fast-growing open source community and help educate next-generation IC… Democratizing IC Design: The IEEE SSCS PICO Program

  • Chiplet Summit

    DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United States

    The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Chiplet Summit

  • Signal Integrity Issues for Silicon Interposers

    The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional design methodologies and flows. Designers of high-speed components are called to co-simulate die, interposers, and package to sign off for their products' signal integrity (SI)… Signal Integrity Issues for Silicon Interposers

  • Making Way for Open-Source Hardware

    This is a thought leadership piece that highlights the significance of open-source hardware. Tony McDowell (Rapid Silicon) and Adam Taylor (Adiuvo) will discuss the innovations and changes required to bring awareness to open-source. Rapid Silicon's Raptor Design Suite toolchain has already proven that designs can be secure even in an open-source environment. Rapid Silicon The… Making Way for Open-Source Hardware

  • Low-Power Verification Using Xcelium Simulation

    Don’t let power-related issues that appear late in the verification cycle impact your project schedule. Register for a webinar that shows you how to catch low-power issues early on. The Cadence low-power solution considers power at every step of the design flow, from architecture to functional verification, analysis, implementation, and signoff. This webinar will focus… Low-Power Verification Using Xcelium Simulation

  • Device Modeling Using Silvaco Utmost IV

    In this webinar, Silvaco will present some of the 2022 Baseline enhancements to our Utmost IV Device Modeling tool. We will introduce the Corner and Retargeting Module, the most recent addition to our modeling software platform, and review some of the newest models and technologies where Silvaco’s Utmost IV is a key contributor. The presentation… Device Modeling Using Silvaco Utmost IV