• CadenceLIVE Silicon Valley 2024

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Join us for CadenceLIVE Silicon Valley 2024 on April 17 at the Santa Clara Convention Center. This annual user conference features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings users, developers, and industry experts together to connect, share ideas, and inspire design creativity. Attendees have the opportunity… CadenceLIVE Silicon Valley 2024

  • Introduction to ParagonX

    Are you ready to supercharge your design process? Introducing our Diakopto Training Program - your gateway to a faster, easier, and more intuitive approach to design analysis and optimization! In this course, you'll learn how to: Analyze and visualize layout parasitics with precision using R/C/delay/I maps. Perform net matching for accurate and refined designs. Identify… Introduction to ParagonX

  • Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP

    Multi-die SoC containing multiple RISC-V clusters, GPU, NPU, accelerators and DNN have considerable benefits for applications in automotive, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models, and multiple coherent and non-coherent compute resources. This Webinar will demonstrate a methodology for rapid modeling and architecture trade-off using UCIe in modeling… Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP

  • Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP

    Multi-die SoC containing multiple RISC-V clusters, GPU, NPU, accelerators and DNN have considerable benefits for applications in automotive, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models, and multiple coherent and non-coherent compute resources. This Webinar will demonstrate a methodology for rapid modeling and architecture trade-off using UCIe in modeling… Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP

  • Latch-Up 2024: Boston

    Massachusetts Institute of Technology 77 Massachusetts Avenue, Boston, MA, United States

    Friday to Sunday April 19–21, 2024 in Boston, MA, USA The Latch-Up conference is a weekend of presentations and networking dedicated to free and open source silicon. It's an event for the open source digital design community, much like its European sister conference ORConf, run by the FOSSi Foundation. You are all invited! The FOSSi… Latch-Up 2024: Boston

  • CICC 2024

    DoubleTree by Hilton Denver 3203 Quebec Street, Denver, CO, United States

    The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design… CICC 2024

  • 42nd VLSI Test Symposium

    Memorial Union Conference Center 1151 S Forest Ave, Tempe, AZ, United States

    The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 22-24 2024, in Tempe, AZ, USA. The program includes keynotes, scientific paper presentations, short industrial application paper presentations, special sessions, and Innovative Practices sessions.… 42nd VLSI Test Symposium

  • Siemens User2User Verification Forum 2024 India

    Hyatt Place, Banjara Hills Road no 1, Banjara Hills, Hyderabad, India

    Join us at the Siemens User2User Verification Forum 2024 in India next week! Gain insights on Smart Verification - Using AI in Functional Verification and learn best practices in design and verification flows that can speed up your ASIC and FPGA design & verification cycle. Don't miss the chance to leverage AI and ML based… Siemens User2User Verification Forum 2024 India

  • osmosis Aerospace and Defense 2024 A Formal Verification Virtual Event

    osmosis Aerospace and Defense (A&D) is about sharing the success in using formal techniques to address the demanding verification requirements and challenges of DO-254 compliant and other high-consequence systems. ‌ We have put together the following program covering a wide range of formal verification topics. Day 1 - Tuesday, April 23 10:00am Pacific | 1:00pm… osmosis Aerospace and Defense 2024 A Formal Verification Virtual Event

  • DVClub Europe – Formal Verification

    13 days to go the next DVClub Europe meeting takes place on Tuesday 23rd April with a theme of "Formal Verification". Formal Verification can help you find bugs earlier in the design cycle and accelerate root cause analysis. But success with Formal requires the effective selection and implementation of the right formal technologies and methods. In this DVClub meeting… DVClub Europe – Formal Verification

  • Deploying Solido Design Environment AI Workflows on AWS

    Utilizing AWS cloud resources to accelerate variation-aware verification   AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on… Deploying Solido Design Environment AI Workflows on AWS

  • TSMC 2024 Technology Symposium – North America

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Learn about: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, capacity expansion… TSMC 2024 Technology Symposium – North America