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Synopsys TCAD Winter Reception
Hotel Nikko 222 Mason Street, San Francisco, CA, United StatesJoin us in person at the Synopsys TCAD Winter Reception on December 10, 2024. You have a chance to meet with our executives and product experts to learn about the latest insights on how Synopsys TCAD products can unleash the power of smart technology modeling - from atoms to circuits. Sign up and learn about… Synopsys TCAD Winter Reception
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ICCAD-Expo 2024
Shanghai International Convention Center No. 2727, Riverside Avenue, Shanghai, ChinaThe China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends.
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17th International MOS-AK Workshop, Silicon Valley
Modeling of Systems and Parameter Extraction Working Group T_0 MOS-AK Welcome and Opening Long Ma and Wladek Grabinski Keysight Technologies (US) and MOS-AK (EU) T_1 What's New in Keysight Device Modeling 2025 Long Ma Keysight Technologies (US) T_2 Si2 Compact Model Coalition 2024 Updates Peter M. Lee CMC Chairman (US) T_3 OpenVAF - status update,… 17th International MOS-AK Workshop, Silicon Valley
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Mastering EMC Simulations for Electronic Designs
Electromagnetic Compatibility (EMC) simulation ensures that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases, the importance of EMC simulation grows, allowing engineers to predict and mitigate potential electromagnetic interference (EMI) issues before physical prototypes are built. Overview It can be challenging for EMC… Mastering EMC Simulations for Electronic Designs
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PDF Solutions – AI Executive Conference
St. Regist Hotel 125 3rd Street, San Francisco, CA, United StatesThis one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI / ML solutions across the global semiconductor industry. Speakers from: ADI, Advantest, Cerebras, Intel, Microsoft, SAP, Siemens, TEL, Teradyne, Voltai, Yurts and… PDF Solutions – AI Executive Conference
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From Concept to QoR: Practical Generative AI for ASIC Managers and Engineers
Be among the first to see how Generative AI is advancing hardware design workflows, providing solutions that reduce complexity and enable better results without steep learning curves. Witness how these tools offer immediate, practical benefits for real-world use cases. What You'll Learn: This session offers a unique opportunity to explore how Generative AI solutions with… From Concept to QoR: Practical Generative AI for ASIC Managers and Engineers
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CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
As the industry reaches the limits of device scaling at advanced nodes, there is a growing demand for increased computing performance and data transfer in hyperscale data centers and AI designs. Advanced systems-on-chip (SoCs) are approaching the maximum size limits, and there is a need to find innovative solutions to continue scaling according to Moore's… CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
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Accelerating SoC Automotive Design with Chiplets
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with chiplets. Here's what you can look forward to: Mastering Chiplet Architecture: Dive into the intricacies of mastering chiplet architecture, where… Accelerating SoC Automotive Design with Chiplets
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Learn How to Utilize Victory Analytics and Machine Learning to Calibrate TCAD Data
Abstract Physics-based design using technology computer-aided design (TCAD) has provided fundamental contributions to R&D in the semiconductor industry. Traditionally, TCAD modeling is mostly developed manually by expert designers using a trial-and-error procedure. However, the imperative acceleration of time-to-market to reduce development expenses calls for renovation of these conventional TCAD approaches. Machine learning (ML) and artificial… Learn How to Utilize Victory Analytics and Machine Learning to Calibrate TCAD Data
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EDAPS 2024
Taj Yeshawantpur 2275 Tumkur Road, Yeshwantpur, Bangalore, IndiaThe IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all… EDAPS 2024
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Advantages of using IP-XACT and TGI for SoC Development
Are you looking for ways to simplify your SoC development process, reduce rework, and accelerate time-to-market? Join us for an insightful webinar, "Advantages of using IP-XACT and TGI for SoC Development," where we’ll explore how the latest features of IP-XACT 2022 can revolutionize your SoC design workflows. What’s on the Agenda? Introduction to IP-XACT: A… Advantages of using IP-XACT and TGI for SoC Development
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Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets at the first package level in combination with advanced 2.5 and 3D packaging technologies. The chiplet approach has the advantage… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
12 events found.