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SEMICON Japan + Advanced Packaging and Chiplet Summit

Tokyo Big Sight 3 Choe-11-1 Ariake, Tokyo, Japan

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently,… Read More »SEMICON Japan + Advanced Packaging and Chiplet Summit

CHIPS Alliance, Fall Technology Update

Join us in-person for our second biannual technology update featuring informative, technical talks on open source hardware collaborative development, hosted by Google and including speakers from Microsoft, Google, Intel, Antmicro, Efabless and others. CHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the… Read More »CHIPS Alliance, Fall Technology Update

Using Formal Datapath Validation to Verify AI Processor Computations

For over a decade, CPU and GPU design companies have been using Synopsys VC Formal Datapath Validation (DPV) app with its HECTOR™ technology to verify their data processing elements because traditional verification methods cannot exhaustively verify the correctness of mathematical computations in these designs. Like CPUs and GPUs, AI processors are also datapath heavy with… Read More »Using Formal Datapath Validation to Verify AI Processor Computations

CSIA-ICCAD 2022

Xiamen International Convention Center 198 Exhibition Road, Xiamen City, China

As a strategic, basic and leading industry in national economic and social development, integrated circuit(IC) industry is an important support for cultivating strategic emerging industries and developing information economy, and plays an important role in the core of information technology field.  Promoting the healthy development of IC industry is the only way to realize the autonomous control… Read More »CSIA-ICCAD 2022

CES 2023

Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United States

CES® is the most influential tech event in the world — the proving ground for breakthrough technologies and global innovators. This is where the world's biggest brands do business and meet new partners, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®, CES features every aspect of the… Read More »CES 2023

VLSID 2023

Hyderabad International Convention Cente Hyderabad, Telangana, India

International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems, is attended by over 2000 engineers, students & faculty, industry, academia, researchers, bureaucrats and government bodies. Semiconductors are the intangible… Read More »VLSID 2023

Photonics: Riding the Waves Along the Spectrum

Cadence Design Systems, Bldg 10 2655 Seeley Avenue, San Jose, CA, United States

Join Cadence in person for the seventh-annual CadenceCONNECT Photonics event and workshop on January 11 and 12 to discuss the successes and impacts of relying mostly on the silicon-based ecosystem in growing the photonics industry. What about applications needing a broader set of wavelengths? Can we expand beyond the traditional domain of silicon photonics? This… Read More »Photonics: Riding the Waves Along the Spectrum

QuantumATK U-2022.12 Release: Highlights of New and Enhanced Features

Join our FREE online event to learn about the latest features and performance enhancements in the QuantumATK U-2022.12 product release. See how QuantumATK can provide impactful ROI on : • Quality of Results: Combination of PAW + LCAO where the highest DFT precision is required • Turnaround Time: Using machine-learning, HKMG and MTJ structures can… Read More »QuantumATK U-2022.12 Release: Highlights of New and Enhanced Features

HiPEAC

Pierre Baudis Convention Centre 11 esplanade Compans Caffarelli, Toulouse, France

The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies, cybersecurity, energy efficiency and machine learning. The HiPEAC 2023 conference will take place in Toulouse, France. Associated workshops, tutorials, special sessions, several… Read More »HiPEAC

ASP-DAC 2023

Tokyo Odaiba Miraikan 2 Chome-3-6 Aomi, Tokyo, Koto CIty, Japan

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2023 is 28th conference. ASP-DAC 2023 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design… Read More »ASP-DAC 2023

Democratizing IC Design: The IEEE SSCS PICO Program

Inspired by the possibilities of open-source chip design, the IEEE Solid-State Circuits Society (SSCS) launched its new Platform for IC Design Outreach (PICO) in the summer of 2021. With this program, the SSCS intends to contribute to the new open source movement, forge connections with the fast-growing open source community and help educate next-generation IC… Read More »Democratizing IC Design: The IEEE SSCS PICO Program

Signal Integrity Issues for Silicon Interposers

The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional design methodologies and flows. Designers of high-speed components are called to co-simulate die, interposers, and package to sign off for their products' signal integrity (SI)… Read More »Signal Integrity Issues for Silicon Interposers