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ITC India 2024
Radisson Blu Outer King Road, Bengaluru, IndiaInternational Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test,… ITC India 2024
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30th Siemens Xcelerator Technology Innovation Awards
Join us as we name the winners of the most prestigious design contest in PCB — the 30th Siemens Xcelerator Technology Innovation Awards! During this live event, we will announce… 30th Siemens Xcelerator Technology Innovation Awards
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Simulating AMD’s next-gen Versal Adaptive SoC devices using Questasim
Versal Adaptive SoC, a revolutionary adaptable platform developed by AMD, integrates several key components such as the AI Engine (AIE), Processing System (PS), Programmable Logic (PL), Network on Chip (NoC),… Simulating AMD’s next-gen Versal Adaptive SoC devices using Questasim
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Chiplets: Building the Future of SoCs
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing… Chiplets: Building the Future of SoCs
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Applying Artificial Intelligence in Fab Technology Co-Optimization
The common approach to optimize a fabrication process involves process and fab engineers creating and setting up Design of Experiments (DoEs) using a trial-and-error approach. This approach often leads to… Applying Artificial Intelligence in Fab Technology Co-Optimization
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Future of Memory and Storage – 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesFMS: the Future of Memory and Storage is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to… Future of Memory and Storage – 2024
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Fab.da: Comprehensive AI-Driven Process Analytics for Faster Ramp and Efficient High-Volume Manufacturing
The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. To… Fab.da: Comprehensive AI-Driven Process Analytics for Faster Ramp and Efficient High-Volume Manufacturing
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Modeling and Simulation of Silicon Photonics Systems in SystemVerilog
Silicon photonics systems integrate photonic components such as optical waveguides, couplers, resonators, photodetectors, etc. along with electronic components on the same silicon chip to realize high-bandwidth, high-density, and low-power communication… Modeling and Simulation of Silicon Photonics Systems in SystemVerilog
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Why Should Our Team be Using VHDL + OSVVM for Verification?
Abstract: This is a high-level presentation that identifies the key aspects of a modern verification methodology and shows how to achieve them with OSVVM. This is a great presentation to… Why Should Our Team be Using VHDL + OSVVM for Verification?
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Cloud Tech Day
Cadence Design Systems, Building 5 2655 Seely Avenue, San Jose, CA, United StatesJoin your fellow engineers and the Cadence Cloud team for an educational and networking event focused on developing a secure and scalable electronic design flow in the cloud. Date: August… Cloud Tech Day
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Mastering EMC Simulations for Electronic Designs
Overview Electromagnetic Compatibility (EMC) simulation is critical for ensuring that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases,… Mastering EMC Simulations for Electronic Designs
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CadenceCONNECT Taiwan 2024
Sheraton Hsinchu Hotel No. 265號, E Section 1, Guangming 6th Rd, Zhubei City, TaiwanCadenceCONNECT Taiwan event will introduce you to optimized design methodologies for electronics system applications. The event brings together Cadence technology users, developers, and industry experts for networking, sharing best practices… CadenceCONNECT Taiwan 2024
12 events found.