• Releasing All Potential of RISC-V: Total Solutions of Andes Core Processors Series

    Join us for an engaging webinar as we delve into the boundless possibilities of RISC-V architecture with a focus on the comprehensive Total Solutions offered by the Andes Series. Explore how these cutting-edge RISC-V CPU cores are reshaping the landscape of computing, powering innovations across diverse applications such as automotive and AI. Our experts will… Releasing All Potential of RISC-V: Total Solutions of Andes Core Processors Series

  • Validating Clarity 3D Solver Accuracy Through Measurement Correlation

    Cadence’s Clarity 3D Solver is an industry-leading EM simulation platform used by hundreds of design teams to address signal and power integrity (SI/PI) challenges. By solving bigger problems on more efficient compute resources, Clarity 3D Solver users have reimagined what can be done with 3D finite element method (FEM) solver technology. However, EM extraction results to… Validating Clarity 3D Solver Accuracy Through Measurement Correlation

  • Verifying AXI Interconnects with ALINT-PRO and Riviera-PRO

    AXI has become the most popular internal bus protocol with today’s FPGA and SoC FPGA designs. ALINT-PRO enables FPGA designers to extract, review and statically verify AXI bus interfaces. In addition, ALINT-PRO can assist with automatic generation of test harnesses for dynamic verification. For dynamic verification of AXI interconnects, Aldec provides FPGA vendor-agnostic AXI Bus… Verifying AXI Interconnects with ALINT-PRO and Riviera-PRO

  • DesignCon 2024

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. 40 Under 40 Calling all Emerging Engineers and Leaders! DesignCon’s 40 Under 40 program launches in 2024 and provides… DesignCon 2024

  • Signal & Power Integrity Special Interest Group

    Hilton Santa Clara 4949 Great America Parkway, Santa Clara, CA, United States

    Dear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara. This event is conveniently located across the street from the DesignCon 2024 Conference allowing you to participate in both. The Synopsys SIPI SIG event will… Signal & Power Integrity Special Interest Group

  • Chiplet Summit

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Chiplet Summit

  • Canada’s Semiconductor Summit

    Brookstreet Hotel 525 Leggett Drive, Ottawa, Canada

    Help build Canada's role in North America's integrated semiconductor supply chain. Featuring key industry and government decision-makers from Canada, the United States, and international jurisdictions, your insights at this by-invitation-only event will help us build an effective action plan. The summit will establish priorities and define opportunities to accelerate the growth, development, and competitiveness of… Canada’s Semiconductor Summit

  • Functional Verification workflow for Trusted and Assured Microelectronics

    In a world of increasing trust and assurance challenges for microelectronic devices, emerging industry standards and defense policy demand early and advanced functional verification methods before ICs may be deployed in critical end products and systems. Questa technologies, built upon a foundation of world-class simulation and formal engines, provide the results desired for raising and meeting higher levels… Functional Verification workflow for Trusted and Assured Microelectronics

  • DVClub Europe: Verifying Safety in Automotive

    Hardware designs intended for the automotive domain need to implement safety mechanisms to minimize the risk of accidents and injuries caused by hardware-related issues in vehicles. In this DVClub we will cover how those safety mechanisms need to be verified to be compliant with ISO26262, the international standard covering automotive safety. Agenda (GMT) 12:00 Welcome… DVClub Europe: Verifying Safety in Automotive

  • Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

    Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating… Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

  • CadenceCONNECT – Photonics Event

    Cadence Design Systems, Bldg 10 2655 Seeley Avenue, San Jose, CA, United States

    Join Cadence in person for the 8th annual CadenceCONNECT Photonics event and workshop on February 7 – 8, 2024, to discuss the increasingly important role of photonics in enabling AI transformation. We all know photonics is essential for communication, but how about computing? What are its advantages and challenges? Which applications are best suited? How… CadenceCONNECT – Photonics Event

  • Power Devices SPICE Modeling for Si, GaN and SiC Technologies

    We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Power Devices SPICE Modeling for Si, GaN and SiC Technologies