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Synopsys Formal Verification SIG 2023
Synopsys 675 Almanor Ave, Sunnyvale, CA, United StatesJoin us in-person on August 9th for the Synopsys Formal Verification SIG 2023 event. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest innovations, techniques and… Synopsys Formal Verification SIG 2023
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CadenceLIVE India
Radisson Blu Outer King Road, Bengaluru, IndiaCadenceLIVE India 2023 will be held on August 9-10 at the Radisson Blu Bengaluru Outer Ring Road. It features peer presentations that offer solutions for today’s design challenges that will… CadenceLIVE India
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Step-by-Step Guide for Your UCIe Design Verification
As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one way for engineers to pack… Step-by-Step Guide for Your UCIe Design Verification
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Dealing with Inconclusive Formal Proofs
Webinar Overview: Formal proofs of end-to-end properties can be a very valuable contribution to RTL sign-off and yet are often the most difficult to achieve. In this webinar Doulos Senior… Dealing with Inconclusive Formal Proofs
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UCIe: On-Package Chiplet Innovation Opportunities
High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc. On-package interconnects are a critical… UCIe: On-Package Chiplet Innovation Opportunities
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Using Generative AI for ASIC Design
Tools like ChatGPT can be used for a variety of purposes, including writing Verilog. Unfortunately, these models are not (yet) perfect, and the quality of the output varies heavily depending… Using Generative AI for ASIC Design
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Advanced Analog Design Using S-parameters
This webinar highlights the importance of S-parameters to IC design and how Semtech Corporation, a high-performance semiconductor, IoT systems and Cloud connectivity service provider, utilizes Siemens AFS XT simulation technology… Advanced Analog Design Using S-parameters
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ERI 2.0 Summit
Hyatt Regency Seattle 805 Howell Street, Seattle, WA, United StatesWatch as leaders from our government agencies, the Defense Industrial Base, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry, national and economic security, and future… ERI 2.0 Summit
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MIPI A-PHY & MASS – Revolutionizing Automotive Connectivity
1) Intro - MASS introduction 2) Usage - Full chip automotive systems from peripheral to processor and vice versa. E.g.Used in Radar, LiDAR, ADAS , etc. 3) APHY - PHY& Link layer… MIPI A-PHY & MASS – Revolutionizing Automotive Connectivity
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Unveiling the Secrets to Proper Version Control, Seamless Data and Tool Integration, and Effective Collaboration
Overview Title: Unveiling the Secrets to Proper Version Control, Seamless Data Integration, and Effective Collaboration Date: Wednesday, August 23, 2023 Time: 10:00 AM Pacific Time Duration: 30 minutes (+15 minutes live Q/A) Join… Unveiling the Secrets to Proper Version Control, Seamless Data and Tool Integration, and Effective Collaboration
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Optimize Test QoR & TTM with AI-Driven Technology
Continuously increasing semiconductor design sizes and complexity have resulted in increased test costs. Today’s competitive environment and critical market windows are pushing companies to adopt aggressive design schedules. The traditional… Optimize Test QoR & TTM with AI-Driven Technology
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IP Lifecycle Management for Chiplet-Based SoCs
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of… IP Lifecycle Management for Chiplet-Based SoCs
12 events found.