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How Silvaco TCAD is at the Heart of Innovation in RF Devices
At high frequency, the accurate modeling of parasitic elements is crucial to IC design. Substrate behavior is a significant contributor to such parasitics, and its modelling is a challenge, not only under small-signal conditions due to strongly non-uniform resistivity profiles in semiconductor materials, but especially under large-amplitude excitations. In this work, Silvaco’s TCAD Victory Device… How Silvaco TCAD is at the Heart of Innovation in RF Devices
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What’s New in Clarity 2022.1
The Cadence® Clarity™ 3D Solver, utilized by scores of customers across the globe, continues to accelerate design flows for leading companies in industries such as medical, hyperscale computing, 5G, automotive, and industrial internet of things (IIoT). The latest 2022.1 release continues to widen the gap between the Clarity 3D finite element (FEM) solver and alternatives in both… What’s New in Clarity 2022.1
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GOMACTech 2022
Hyatt Regecy Miami 400 South East Second Avenue, Miami, FL, United StatesWELCOME TO GOMACTech 2022 Enabling Distributed Capabilities: Microelectronics Thriving in the Face of Change GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce… GOMACTech 2022
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SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
Nowadays, fleets of connected devices have operational needs to maintain over time a relevant level of security. To mitigate the growing threats and vulnerabilities in the field and protect end-user devices from cyberattacks at both the network and device levels, a new strategy is needed to filter attacks in real time and implement a centralized… SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
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CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis is extremely critical in 3D-ICs, since changing the die stack up later in the design process… CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
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Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
Synopsys would like to invite you to the 4th annual, and 2nd virtual, Synopsys CAD Navigation Users Group to be held in March 2022. Date & Time: Thursday, March 24, 2022. 07:00 a.m. – 09:00 a.m. PT Venue Details: Virtual Conference We have planned an exciting event with presentations from a diverse group of CADNav… Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
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Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
Silicon IGBT and SiC MOSFETs are today's key power semiconductor switches for many power electronics converters such as those in automotive, renewables and industrial applications. Both device concepts continue to evolve, and development trends are continuously targeting improved overall electrical and reliability performance at lower costs. In addition to established power device manufacturers, many start-up… Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
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IRPS 2022
Hilton DFW Lakes Executive Conference Center 1800 Highway 26E, Grapevine, TX, United StatesFor 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world. The 2022 IEEE IRPS will be presented as an in-person conference with a virtual component.… IRPS 2022
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tinyML Summit 2022
Hyatt Regecy San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United StatesRegistration will open by January 31 What seemed like a dream a few years ago is quickly turning into reality. Problems which used to require Gigabytes to solve, became Megabytes and then Kilobytes. Join us at the tinyML Summit 2022 to take part in the sharing, learning, and celebrating tinyML. With ever more pervasive advances… tinyML Summit 2022
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Secure Your Devices with PUF Plus Hardware Root of Trust
Technology experts from Rambus and Intrinsic ID will discuss how combining PUF technology with a hardware Root of Trust can provide robust security for data and devices. The session will start with the fundamentals of PUFs and example use cases. Then we will discuss how the characteristics of PUFs and a hardware Root of Trust… Secure Your Devices with PUF Plus Hardware Root of Trust
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SNUG – Silicon Valley
SNUG brings together users and technical experts to network and share best practices for tackling design and verification challenges. By attending SNUG, attendees gain knowledge to use on current projects and discover ideas to spark future innovations. SNUG Silicon Valley will be conducted in a virtual format due to recent COVID-19 developments that have raised concerns among attendees… SNUG – Silicon Valley
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DVClub Austin – March 30, 2022, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm)
Norris Conference Center 2525 W Anderson Ln, #365, Austin, TX, United StatesPlease join us on March 30, 2022 at the Norris Conference Center for a catered lunch and networking. Rahul Peddi, a Senior Design Engineer at Arm, and Vaibhav Agrawal, a member of the CPU formal verification team at Arm, will be our guest speakers. 11:30am — Doors Open / Networking 12:00pm — Lunch / Presentations by Rahul Peddi… DVClub Austin – March 30, 2022, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm)
12 events found.