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Turbo-Charge Your Embedded CI/CD Setup Using Virtual Prototypes
Using virtual prototypes in your continuous integration/continuous delivery (CI/CD) setup can boost your embedded software development team’s productivity. Traditionally, such setups have depended on physical hardware boards, which come with a host of downsides, such as late availability, high cost, and maintenance issues as well as the possibility of damage during testing of fault conditions.… Turbo-Charge Your Embedded CI/CD Setup Using Virtual Prototypes
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Better FPGA Verification with VHDL: OSVVM – Leading Edge Verification for the VHDL Community
OSVVM is an advanced verification methodology that defines a VHDL verification framework, verification utility library, verification component library, and a scripting flow that simplifies your FPGA verification projects from start to finish. Using these libraries, you can create a simple, readable, and powerful testbench that is suitable for either simple or complex FPGA blocks. Looking… Better FPGA Verification with VHDL: OSVVM – Leading Edge Verification for the VHDL Community
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ISCAS 2022
Austin Hilto 500 E 4th Street, Austin, TX, United StatesThe IEEE International Symposium on Circuits and Systems (ISCAS) ISCAS 2022 will be held in Austin Texas from May 28 through June 1. Austin is one of the fastest growing cities in the United States. Much of this growth is attributable to the rapidly growing tech sector in the Austin metropolitan area. The large and… ISCAS 2022
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RISC-V Days Tokyo 2022 Spring
RISC-V Days Tokyo is Japan’s largest online RISC-V event. Live online presentations are hosted on May 31st (Tue), June 1st (Wed) and 2nd (Thu). There will also be a virtual “RISC-V Pavilion” for the last two days. RISC-V Days Tokyo aims to bring together leading RISC-V technologies and products, key persons and engineers, and to… RISC-V Days Tokyo 2022 Spring
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2022 IEEE 72nd Electronic Components and Technology Conference
The Sheraton San Diego Hotel and Marina 1380 Harbor Island Drive, San Diego, CA, United StatesThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. Abstract Submission is Open | Subscribe to our mailing list
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ITherm 2022
Sheraton Hotel & Marina 1380 Harbor Island Drive, San Diego, CA, United StatesWelcome to ITherm 2022 The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems May 31 - June 3, 2022 Sheraton Hotel & Marina San Diego, CA USA (Co-Located with ECTC) Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging… ITherm 2022
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Automotive Ethernet Congress
Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Munich, GermanyWELCOME POWERFUL NETWORK FOR THE COMPUTER ON WHEELS The Automotive Ethernet Congress will take place for the eighth time on June 1 - 2, 2022. The conference program will highlight the entire spectrum of topics relating to the use of Ethernet in vehicles. The vehicle is undergoing the greatest change since its inception. Automation, networking, and digitalization of the… Automotive Ethernet Congress
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Become an SVA Expert in One Hour
Doulos Co-Founder & Technical Fellow John Aynsley will teach the core principles necessary to understand and use SystemVerilog Assertions, focussing on the aspects of SVA that are applicable to both formal verification and simulation. Particular emphasis will be placed on the core semantics of temporal logic so that you will be able to write your own assertions,… Become an SVA Expert in One Hour
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ASYNC 2022 Summer School: Behavioral Design
The steering committee of the IEEE ASYNC symposium is organizing a summer school on asynchronous design. The goal of the school is to teach asynchronous chip design to students and practitioners interested in digital hardware design. Participants will learn how to design asynchronous circuits at the behavioral level, gate level, and physical design level using… ASYNC 2022 Summer School: Behavioral Design
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Embedded Applications Get a Helping Hand: Extensible Processor Architectures
Industry consolidation and cost streamlining eliminated many proprietary processor architectures and channeled alignment to a subset of standardized instruction set architectures (ISAs). Today, many embedded applications such as those found in artificial intelligence (AI), automotive and storage segments require increased bandwidth and memory address space expansion. As Moore’s law slows, design teams seek different ways… Embedded Applications Get a Helping Hand: Extensible Processor Architectures
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Customers Discuss Their Real World Use of High-Level Synthesis
Summary The focus of this seminar is to have real-world customers present their successes using Catapult High-Level Synthesis (HLS) in markets such as Automotive, 5G/Communications, Video/Imaging, AI/ML, and MEMs Sensors. The companies who will be presenting are: Google (Video/Imaging) NASA-JPL (Video/Imaging) NVIDIA (Video/Imaging) NVIDIA Research (AI/ML) NXP Semiconductors (Automotive) STMicroelectronics (MEMS Sensors) Viosoft (5G/Communications) In… Customers Discuss Their Real World Use of High-Level Synthesis
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CadenceLIVE 2022 – Silicon Valley
Cadence San Jose, CA, United StatesAre you driving design change or feel you’ve overcome challenges that could impact the electronic revolution? CadenceLIVE™ offers you an opportunity to tell your story. Showcase your expertise and offer tips to address the complexities and challenges that engineers face today. CadenceLIVE Silicon Valley features peer presentations that highlight solutions, using Cadence® products, for today’s… CadenceLIVE 2022 – Silicon Valley
12 events found.